Plasma Cleaning System
Hydrophobic
With 6 trays
Gas: Ar N2 & others
For mass-production
Process time: Max 5 min / 1 tray
Process capacity:
0805 type 1.2 million / h
Hydrophilic and Hydrophobic automated type
With 1 tray
Gas: N2 O2 & others
Process time:
Hydrophilic 1min / 1 tray
Hydrophobic 5min / 1 tray
*Fully automated system
Hydrophilic and Hydrophobic manual type
With 1 tray
Gas: Ar O2 N2 & others
Process time:
Hydrophilic 1 min / 1 tray
Hydrophobic 5 min / 1 tray
*Many kinds with small quantity
Improved hydrophilic and hydrophobic for MLCC.
Can improve the hydrophilic on MLCC surface, such as plating after barrel tumbling and stabilize product plating.
Easy barrel tumbling and plating without floating in water.
Merit
Easy process
Improved quality
Equalization of barrel tumbling for chips on parts corner.
Equalization of plating thickness.
Hydrophobic control of small electric parts and material
before dipping Ag.
Improvement of moon ( mount ) with Ag adhesion.
Hydrophobic
With 6 trays
Gas: Ar N2 & others
For mass-production
Process time: Max 5 min / 1 tray
Process capacity:
0805 type 1.2 million / h
Hydrophilic and Hydrophobic automated type
With 1 tray
Gas: N2 O2 & others
Process time:
Hydrophilic 1min / 1 tray
Hydrophobic 5min / 1 tray
*Fully automated system
Hydrophilic and Hydrophobic manual type
With 1 tray
Gas: Ar O2 N2 & others
Process time:
Hydrophilic 1 min / 1 tray
Hydrophobic 5 min / 1 tray
*Many kinds with small quantity
Improved hydrophilic and hydrophobic for MLCC.
Can improve the hydrophilic on MLCC surface, such as plating after barrel tumbling and stabilize product plating.
Easy barrel tumbling and plating without floating in water.
Merit
Easy process
Improved quality
Equalization of barrel tumbling for chips on parts corner.
Equalization of plating thickness.
Hydrophobic control of small electric parts and material
before dipping Ag.
Improvement of moon ( mount ) with Ag adhesion.